Wireless communication interconnection system and wall-mount kit thereof

A wireless communication interconnection system and wall-mount kit thereof, the wall-mount kit includes a first communication set having first main printed circuit board assembly and a first auxiliary printed circuit board assembly, the first main printed circuit board assembly includes first IC pac...

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Hauptverfasser: LIN, WEIIH, HSIAO, SHIH-WEI, HSU, HSIU-YUAN, HSU, SHUO-HSIU, CHEN, PAUL, HUANG, CHENG-KAI, LIU, JIA-HAU, CHOU, WEI NONG, HSIEH, CHIHUNG, KO, YEN-HSU, LEE, GENN-SHENG, WENG, MAOUN
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creator LIN, WEIIH
HSIAO, SHIH-WEI
HSU, HSIU-YUAN
HSU, SHUO-HSIU
CHEN, PAUL
HUANG, CHENG-KAI
LIU, JIA-HAU
CHOU, WEI NONG
HSIEH, CHIHUNG
KO, YEN-HSU
LEE, GENN-SHENG
WENG, MAOUN
description A wireless communication interconnection system and wall-mount kit thereof, the wall-mount kit includes a first communication set having first main printed circuit board assembly and a first auxiliary printed circuit board assembly, the first main printed circuit board assembly includes first IC packages for transmitting extremely high frequency signals, the first auxiliary printed circuit board assembly includes an electrical connector for delivering at least power, the first auxiliary printed circuit board assembly is essentially located in a center region of the first main printed circuit board assembly.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201931694A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201931694A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201931694A3</originalsourceid><addsrcrecordid>eNrjZPAIzyxKzUktLlZIzs_NLc3LTE4syczPU8jMK0ktSs7Py0tNBvOLK4tLUnMVEvNSFMoTc3J0c_NL80oUsjNLFEoyUotS89N4GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakl8SLiRgaGlsaGZpYmjMTFqADCvNXw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wireless communication interconnection system and wall-mount kit thereof</title><source>esp@cenet</source><creator>LIN, WEIIH ; HSIAO, SHIH-WEI ; HSU, HSIU-YUAN ; HSU, SHUO-HSIU ; CHEN, PAUL ; HUANG, CHENG-KAI ; LIU, JIA-HAU ; CHOU, WEI NONG ; HSIEH, CHIHUNG ; KO, YEN-HSU ; LEE, GENN-SHENG ; WENG, MAOUN</creator><creatorcontrib>LIN, WEIIH ; HSIAO, SHIH-WEI ; HSU, HSIU-YUAN ; HSU, SHUO-HSIU ; CHEN, PAUL ; HUANG, CHENG-KAI ; LIU, JIA-HAU ; CHOU, WEI NONG ; HSIEH, CHIHUNG ; KO, YEN-HSU ; LEE, GENN-SHENG ; WENG, MAOUN</creatorcontrib><description>A wireless communication interconnection system and wall-mount kit thereof, the wall-mount kit includes a first communication set having first main printed circuit board assembly and a first auxiliary printed circuit board assembly, the first main printed circuit board assembly includes first IC packages for transmitting extremely high frequency signals, the first auxiliary printed circuit board assembly includes an electrical connector for delivering at least power, the first auxiliary printed circuit board assembly is essentially located in a center region of the first main printed circuit board assembly.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; COMPUTING ; COUNTING ; CURRENT COLLECTORS ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRICITY ; LINE CONNECTORS ; PHYSICS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190801&amp;DB=EPODOC&amp;CC=TW&amp;NR=201931694A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190801&amp;DB=EPODOC&amp;CC=TW&amp;NR=201931694A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN, WEIIH</creatorcontrib><creatorcontrib>HSIAO, SHIH-WEI</creatorcontrib><creatorcontrib>HSU, HSIU-YUAN</creatorcontrib><creatorcontrib>HSU, SHUO-HSIU</creatorcontrib><creatorcontrib>CHEN, PAUL</creatorcontrib><creatorcontrib>HUANG, CHENG-KAI</creatorcontrib><creatorcontrib>LIU, JIA-HAU</creatorcontrib><creatorcontrib>CHOU, WEI NONG</creatorcontrib><creatorcontrib>HSIEH, CHIHUNG</creatorcontrib><creatorcontrib>KO, YEN-HSU</creatorcontrib><creatorcontrib>LEE, GENN-SHENG</creatorcontrib><creatorcontrib>WENG, MAOUN</creatorcontrib><title>Wireless communication interconnection system and wall-mount kit thereof</title><description>A wireless communication interconnection system and wall-mount kit thereof, the wall-mount kit includes a first communication set having first main printed circuit board assembly and a first auxiliary printed circuit board assembly, the first main printed circuit board assembly includes first IC packages for transmitting extremely high frequency signals, the first auxiliary printed circuit board assembly includes an electrical connector for delivering at least power, the first auxiliary printed circuit board assembly is essentially located in a center region of the first main printed circuit board assembly.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAIzyxKzUktLlZIzs_NLc3LTE4syczPU8jMK0ktSs7Py0tNBvOLK4tLUnMVEvNSFMoTc3J0c_NL80oUsjNLFEoyUotS89N4GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakl8SLiRgaGlsaGZpYmjMTFqADCvNXw</recordid><startdate>20190801</startdate><enddate>20190801</enddate><creator>LIN, WEIIH</creator><creator>HSIAO, SHIH-WEI</creator><creator>HSU, HSIU-YUAN</creator><creator>HSU, SHUO-HSIU</creator><creator>CHEN, PAUL</creator><creator>HUANG, CHENG-KAI</creator><creator>LIU, JIA-HAU</creator><creator>CHOU, WEI NONG</creator><creator>HSIEH, CHIHUNG</creator><creator>KO, YEN-HSU</creator><creator>LEE, GENN-SHENG</creator><creator>WENG, MAOUN</creator><scope>EVB</scope></search><sort><creationdate>20190801</creationdate><title>Wireless communication interconnection system and wall-mount kit thereof</title><author>LIN, WEIIH ; HSIAO, SHIH-WEI ; HSU, HSIU-YUAN ; HSU, SHUO-HSIU ; CHEN, PAUL ; HUANG, CHENG-KAI ; LIU, JIA-HAU ; CHOU, WEI NONG ; HSIEH, CHIHUNG ; KO, YEN-HSU ; LEE, GENN-SHENG ; WENG, MAOUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201931694A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN, WEIIH</creatorcontrib><creatorcontrib>HSIAO, SHIH-WEI</creatorcontrib><creatorcontrib>HSU, HSIU-YUAN</creatorcontrib><creatorcontrib>HSU, SHUO-HSIU</creatorcontrib><creatorcontrib>CHEN, PAUL</creatorcontrib><creatorcontrib>HUANG, CHENG-KAI</creatorcontrib><creatorcontrib>LIU, JIA-HAU</creatorcontrib><creatorcontrib>CHOU, WEI NONG</creatorcontrib><creatorcontrib>HSIEH, CHIHUNG</creatorcontrib><creatorcontrib>KO, YEN-HSU</creatorcontrib><creatorcontrib>LEE, GENN-SHENG</creatorcontrib><creatorcontrib>WENG, MAOUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN, WEIIH</au><au>HSIAO, SHIH-WEI</au><au>HSU, HSIU-YUAN</au><au>HSU, SHUO-HSIU</au><au>CHEN, PAUL</au><au>HUANG, CHENG-KAI</au><au>LIU, JIA-HAU</au><au>CHOU, WEI NONG</au><au>HSIEH, CHIHUNG</au><au>KO, YEN-HSU</au><au>LEE, GENN-SHENG</au><au>WENG, MAOUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wireless communication interconnection system and wall-mount kit thereof</title><date>2019-08-01</date><risdate>2019</risdate><abstract>A wireless communication interconnection system and wall-mount kit thereof, the wall-mount kit includes a first communication set having first main printed circuit board assembly and a first auxiliary printed circuit board assembly, the first main printed circuit board assembly includes first IC packages for transmitting extremely high frequency signals, the first auxiliary printed circuit board assembly includes an electrical connector for delivering at least power, the first auxiliary printed circuit board assembly is essentially located in a center region of the first main printed circuit board assembly.</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
recordid cdi_epo_espacenet_TW201931694A
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subjects BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
CURRENT COLLECTORS
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
LINE CONNECTORS
PHYSICS
title Wireless communication interconnection system and wall-mount kit thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T20%3A08%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIN,%20WEIIH&rft.date=2019-08-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW201931694A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true