Devices with chamfer-less vias multi-patterning and methods for forming chamfer-less vias

Semiconductor devices and methods of fabricating the semiconductor devices with chamfer-less via multi-patterning are disclosed. One method includes, for instance: obtaining an intermediate semiconductor device; performing a trench etch into a portion of the intermediate semiconductor device to form...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JANG, LINUS, BOUCHE, GUILLAUME, HU, XIANG, WEI, ANDY, SEHGAL, AKSHEY, KM MAHALINGAM, ANBU SELVAM, AUGUR, RODERICK ALAN, CHILD JR., CRAIG MICHAEL, STEPHENS, JASON EUGENE, ZALESKI, MARK, PAL, SHYAM, PERMANA, DAVID MICHAEL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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