Plating liquid

This plating liquid contains (A) a soluble salt that contains at least a first tin salt, (B) an acid selected from among organic acids and inorganic acids or a salt thereof, and (C) two surfactants, namely an amine-based surfactant (C1) and a nonionic surfactant (C2 and/or C3). The amine-based surfa...

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Hauptverfasser:	KONNO, YASUSHI, NAKAYA, KIYOTAKA, WATANABE, MAMI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator	KONNO, YASUSHI NAKAYA, KIYOTAKA WATANABE, MAMI
description	This plating liquid contains (A) a soluble salt that contains at least a first tin salt, (B) an acid selected from among organic acids and inorganic acids or a salt thereof, and (C) two surfactants, namely an amine-based surfactant (C1) and a nonionic surfactant (C2 and/or C3). The amine-based surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropylene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula (2), m is 15-30 and (n1 + n2) is 40-50. In formula (3), (m1 + m2) is 15-30 and n is 40-50.
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The amine-based surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropylene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula (2), m is 15-30 and (n1 + n2) is 40-50. In formula (3), (m1 + m2) is 15-30 and n is 40-50.</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181216&DB=EPODOC&CC=TW&NR=201843354A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181216&DB=EPODOC&CC=TW&NR=201843354A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KONNO, YASUSHI</creatorcontrib><creatorcontrib>NAKAYA, KIYOTAKA</creatorcontrib><creatorcontrib>WATANABE, MAMI</creatorcontrib><title>Plating liquid</title><description>This plating liquid contains (A) a soluble salt that contains at least a first tin salt, (B) an acid selected from among organic acids and inorganic acids or a salt thereof, and (C) two surfactants, namely an amine-based surfactant (C1) and a nonionic surfactant (C2 and/or C3). The amine-based surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropylene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula (2), m is 15-30 and (n1 + n2) is 40-50. 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The amine-based surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropylene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula (2), m is 15-30 and (n1 + n2) is 40-50. In formula (3), (m1 + m2) is 15-30 and n is 40-50.</abstract><oa>free_for_read</oa></addata></record>
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subjects	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title	Plating liquid
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