Copper particles and manufacturing method therefor

These copper particles each comprise: a core part containing copper; and a copper oxide layer formed on the surface of the core part and containing CuO and Cu2O. The condition of Y ≥ 36X - 18 is satisfied where X is the content ratio (mass %) of oxygen contained in a copper particle and Y is the cry...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MATSUYAMA, TOSHIKAZU, UWAZUMI, YOSHIAKI, OTA, KOYU, ENDO, YASUTOSHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!