Pickup device and pickup method

The present invention comprises: a stage (20) that includes a suction surface (22) that suctions a sheet (12); a push-up member (30) that pushes up the sheet (12); and a three-way valve (67) that switches the opening pressure of an opening (23) between a first pressure that is near a vacuum and a se...

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creator NAGANO, KAZUAKI
description The present invention comprises: a stage (20) that includes a suction surface (22) that suctions a sheet (12); a push-up member (30) that pushes up the sheet (12); and a three-way valve (67) that switches the opening pressure of an opening (23) between a first pressure that is near a vacuum and a second pressure that is near atmospheric pressure. When a semiconductor die (15) is picked up together with a viscoelastic film (11), the opening pressure is caused to vibrate at a prescribed frequency that corresponds to the viscoelastic characteristics of the viscoelastic film (11) when the suction pressure of the suction surface (22) is set at a third pressure that is near a vacuum, and the sheet (12) is pushed up by the push-up member (30). A thin semiconductor die affixed to the surface of the sheet by the viscoelastic film is thereby picked up from the surface of the sheet together with the viscoelastic film.
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
COMBINED OPERATIONS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
UNIVERSAL MACHINE TOOLS
title Pickup device and pickup method
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