System and method for generation of wafer inspection critical areas

A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive charact...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KULKARNI, ASHOK V, MANEPALLI, RAJESH, UPPALURI, PRASANTI, KIRKLAND, JOHN, BANERJEE, SAIBAL
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KULKARNI, ASHOK V
MANEPALLI, RAJESH
UPPALURI, PRASANTI
KIRKLAND, JOHN
BANERJEE, SAIBAL
description A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201834098A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201834098A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201834098A3</originalsourceid><addsrcrecordid>eNrjZHAOriwuSc1VSMxLUchNLcnIT1FIyy9SSE_NSy1KLMnMz1PIT1MoT0xLLVLIzCsuSE0GiyUXZZZkJifmKCQWpSYW8zCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxGSgaSXxIeFGBoYWxiYGlhaOxsSoAQCAWzKt</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>System and method for generation of wafer inspection critical areas</title><source>esp@cenet</source><creator>KULKARNI, ASHOK V ; MANEPALLI, RAJESH ; UPPALURI, PRASANTI ; KIRKLAND, JOHN ; BANERJEE, SAIBAL</creator><creatorcontrib>KULKARNI, ASHOK V ; MANEPALLI, RAJESH ; UPPALURI, PRASANTI ; KIRKLAND, JOHN ; BANERJEE, SAIBAL</creatorcontrib><description>A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180916&amp;DB=EPODOC&amp;CC=TW&amp;NR=201834098A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76304</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180916&amp;DB=EPODOC&amp;CC=TW&amp;NR=201834098A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KULKARNI, ASHOK V</creatorcontrib><creatorcontrib>MANEPALLI, RAJESH</creatorcontrib><creatorcontrib>UPPALURI, PRASANTI</creatorcontrib><creatorcontrib>KIRKLAND, JOHN</creatorcontrib><creatorcontrib>BANERJEE, SAIBAL</creatorcontrib><title>System and method for generation of wafer inspection critical areas</title><description>A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAOriwuSc1VSMxLUchNLcnIT1FIyy9SSE_NSy1KLMnMz1PIT1MoT0xLLVLIzCsuSE0GiyUXZZZkJifmKCQWpSYW8zCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxGSgaSXxIeFGBoYWxiYGlhaOxsSoAQCAWzKt</recordid><startdate>20180916</startdate><enddate>20180916</enddate><creator>KULKARNI, ASHOK V</creator><creator>MANEPALLI, RAJESH</creator><creator>UPPALURI, PRASANTI</creator><creator>KIRKLAND, JOHN</creator><creator>BANERJEE, SAIBAL</creator><scope>EVB</scope></search><sort><creationdate>20180916</creationdate><title>System and method for generation of wafer inspection critical areas</title><author>KULKARNI, ASHOK V ; MANEPALLI, RAJESH ; UPPALURI, PRASANTI ; KIRKLAND, JOHN ; BANERJEE, SAIBAL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201834098A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KULKARNI, ASHOK V</creatorcontrib><creatorcontrib>MANEPALLI, RAJESH</creatorcontrib><creatorcontrib>UPPALURI, PRASANTI</creatorcontrib><creatorcontrib>KIRKLAND, JOHN</creatorcontrib><creatorcontrib>BANERJEE, SAIBAL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KULKARNI, ASHOK V</au><au>MANEPALLI, RAJESH</au><au>UPPALURI, PRASANTI</au><au>KIRKLAND, JOHN</au><au>BANERJEE, SAIBAL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>System and method for generation of wafer inspection critical areas</title><date>2018-09-16</date><risdate>2018</risdate><abstract>A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW201834098A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
title System and method for generation of wafer inspection critical areas
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T12%3A42%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KULKARNI,%20ASHOK%20V&rft.date=2018-09-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW201834098A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true