Target location in semiconductor manufacturing

A method of overlay control in silicon wafer manufacturing comprises firstly locating a target comprising a diffraction grating on a wafer layer; and then measuring the alignment of patterns in successive layers of the wafer. The location of the target may be done by the pupil camera rather than a v...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GUTMAN, NADAV, ITTAH, NAOMI, AMIT, ERAN, PELED, EINAT, IMMER, VINCENT
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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