Method and system for automatic bond arm alignment

A method, as well as a system implementing the method, for automatically aligning a bond arm with respect to a bonding support surface for supporting a substrate during a bonding process. The method comprises: rotating the bond arm for a first revolution around a longitudinal axis through a bond hea...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAU, WAN YIN, TANG, LIANG HONG, WOO, SHUI CHEUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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