Method of determining output flow rate of gas output by flow rate controller of substrate processing apparatus

Method of determining output flow rate of gas output by flow rate controller of substrate processing apparatus

In a method of an embodiment, a pressure sensor is selected from first and second pressure sensors according to a set flow rate. A measurable maximum pressure of the second pressure sensor is higher than a measurable maximum pressure of first pressure sensor. The target pressure of a chamber is dete...

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Hauptverfasser: HOSHI, NAOTSUGU, FUJII, HIROSHI, TSURUTA, TOSHIHIRO, AKIBA, JUNICHI, JAMI, NAOYA, HAYASAKA, SHINICHIRO, YAMASHIMA, JUN
Format: Patent
Sprache:chi ; eng
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CONTROLLING
PHYSICS
REGULATING
SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
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creator HOSHI, NAOTSUGU
FUJII, HIROSHI
TSURUTA, TOSHIHIRO
AKIBA, JUNICHI
JAMI, NAOYA
HAYASAKA, SHINICHIRO
YAMASHIMA, JUN
description In a method of an embodiment, a pressure sensor is selected from first and second pressure sensors according to a set flow rate. A measurable maximum pressure of the second pressure sensor is higher than a measurable maximum pressure of first pressure sensor. The target pressure of a chamber is determined according to the set flow rate. Until the pressure of the chamber reaches the target pressure after gas is started to be output from the flow rate controller to the chamber at an output flow rate according to the set flow rate and a pressure controller provided between the chamber and an exhaust apparatus is closed, the pressure of the chamber is measured by the selected pressure sensor. The output flow rate of the flow rate controller is determined from a rate of rise of the pressure of the chamber.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201827970A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201827970A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201827970A3</originalsourceid><addsrcrecordid>eNqNjLEKwjAURbM4iPoP8QOEWofqKKK4uBUcS5q-tIWY98h7Qfx7jSg4Ol0453CnKlxABuw0Ot2BQLyNYQy9xiSURDuPdx2NQPa94S9vHz_KYpCI3kPMFaeW5c0pogXmfGeIzIslnquJM55h8dmZWp6O9eG8AsIGmIyFANLU17JYb8tqVxX7zT_NEwSKQ3Y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of determining output flow rate of gas output by flow rate controller of substrate processing apparatus</title><source>esp@cenet</source><creator>HOSHI, NAOTSUGU ; FUJII, HIROSHI ; TSURUTA, TOSHIHIRO ; AKIBA, JUNICHI ; JAMI, NAOYA ; HAYASAKA, SHINICHIRO ; YAMASHIMA, JUN</creator><creatorcontrib>HOSHI, NAOTSUGU ; FUJII, HIROSHI ; TSURUTA, TOSHIHIRO ; AKIBA, JUNICHI ; JAMI, NAOYA ; HAYASAKA, SHINICHIRO ; YAMASHIMA, JUN</creatorcontrib><description>In a method of an embodiment, a pressure sensor is selected from first and second pressure sensors according to a set flow rate. A measurable maximum pressure of the second pressure sensor is higher than a measurable maximum pressure of first pressure sensor. The target pressure of a chamber is determined according to the set flow rate. Until the pressure of the chamber reaches the target pressure after gas is started to be output from the flow rate controller to the chamber at an output flow rate according to the set flow rate and a pressure controller provided between the chamber and an exhaust apparatus is closed, the pressure of the chamber is measured by the selected pressure sensor. The output flow rate of the flow rate controller is determined from a rate of rise of the pressure of the chamber.</description><language>chi ; eng</language><subject>CONTROLLING ; PHYSICS ; REGULATING ; SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180801&amp;DB=EPODOC&amp;CC=TW&amp;NR=201827970A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180801&amp;DB=EPODOC&amp;CC=TW&amp;NR=201827970A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOSHI, NAOTSUGU</creatorcontrib><creatorcontrib>FUJII, HIROSHI</creatorcontrib><creatorcontrib>TSURUTA, TOSHIHIRO</creatorcontrib><creatorcontrib>AKIBA, JUNICHI</creatorcontrib><creatorcontrib>JAMI, NAOYA</creatorcontrib><creatorcontrib>HAYASAKA, SHINICHIRO</creatorcontrib><creatorcontrib>YAMASHIMA, JUN</creatorcontrib><title>Method of determining output flow rate of gas output by flow rate controller of substrate processing apparatus</title><description>In a method of an embodiment, a pressure sensor is selected from first and second pressure sensors according to a set flow rate. A measurable maximum pressure of the second pressure sensor is higher than a measurable maximum pressure of first pressure sensor. The target pressure of a chamber is determined according to the set flow rate. Until the pressure of the chamber reaches the target pressure after gas is started to be output from the flow rate controller to the chamber at an output flow rate according to the set flow rate and a pressure controller provided between the chamber and an exhaust apparatus is closed, the pressure of the chamber is measured by the selected pressure sensor. The output flow rate of the flow rate controller is determined from a rate of rise of the pressure of the chamber.</description><subject>CONTROLLING</subject><subject>PHYSICS</subject><subject>REGULATING</subject><subject>SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKwjAURbM4iPoP8QOEWofqKKK4uBUcS5q-tIWY98h7Qfx7jSg4Ol0453CnKlxABuw0Ot2BQLyNYQy9xiSURDuPdx2NQPa94S9vHz_KYpCI3kPMFaeW5c0pogXmfGeIzIslnquJM55h8dmZWp6O9eG8AsIGmIyFANLU17JYb8tqVxX7zT_NEwSKQ3Y</recordid><startdate>20180801</startdate><enddate>20180801</enddate><creator>HOSHI, NAOTSUGU</creator><creator>FUJII, HIROSHI</creator><creator>TSURUTA, TOSHIHIRO</creator><creator>AKIBA, JUNICHI</creator><creator>JAMI, NAOYA</creator><creator>HAYASAKA, SHINICHIRO</creator><creator>YAMASHIMA, JUN</creator><scope>EVB</scope></search><sort><creationdate>20180801</creationdate><title>Method of determining output flow rate of gas output by flow rate controller of substrate processing apparatus</title><author>HOSHI, NAOTSUGU ; FUJII, HIROSHI ; TSURUTA, TOSHIHIRO ; AKIBA, JUNICHI ; JAMI, NAOYA ; HAYASAKA, SHINICHIRO ; YAMASHIMA, JUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201827970A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>CONTROLLING</topic><topic>PHYSICS</topic><topic>REGULATING</topic><topic>SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES</topic><toplevel>online_resources</toplevel><creatorcontrib>HOSHI, NAOTSUGU</creatorcontrib><creatorcontrib>FUJII, HIROSHI</creatorcontrib><creatorcontrib>TSURUTA, TOSHIHIRO</creatorcontrib><creatorcontrib>AKIBA, JUNICHI</creatorcontrib><creatorcontrib>JAMI, NAOYA</creatorcontrib><creatorcontrib>HAYASAKA, SHINICHIRO</creatorcontrib><creatorcontrib>YAMASHIMA, JUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOSHI, NAOTSUGU</au><au>FUJII, HIROSHI</au><au>TSURUTA, TOSHIHIRO</au><au>AKIBA, JUNICHI</au><au>JAMI, NAOYA</au><au>HAYASAKA, SHINICHIRO</au><au>YAMASHIMA, JUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of determining output flow rate of gas output by flow rate controller of substrate processing apparatus</title><date>2018-08-01</date><risdate>2018</risdate><abstract>In a method of an embodiment, a pressure sensor is selected from first and second pressure sensors according to a set flow rate. A measurable maximum pressure of the second pressure sensor is higher than a measurable maximum pressure of first pressure sensor. The target pressure of a chamber is determined according to the set flow rate. Until the pressure of the chamber reaches the target pressure after gas is started to be output from the flow rate controller to the chamber at an output flow rate according to the set flow rate and a pressure controller provided between the chamber and an exhaust apparatus is closed, the pressure of the chamber is measured by the selected pressure sensor. The output flow rate of the flow rate controller is determined from a rate of rise of the pressure of the chamber.</abstract><oa>free_for_read</oa></addata></record>
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subjects CONTROLLING
PHYSICS
REGULATING
SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
title Method of determining output flow rate of gas output by flow rate controller of substrate processing apparatus
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T05%3A00%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HOSHI,%20NAOTSUGU&rft.date=2018-08-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW201827970A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true