Electronic circuit module and manufacturing method of the same

Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shiel...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OKAZAKI, MICHITAKA, YOKOZAWA, TOMOHIDE, KATSUMATA, MASASHI, SUZUKI, YOSHIHIRO, AOKI, TAKURO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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