Substrate heating apparatus and substrate heating method shortening the tact time required for heating a substrate

This invention shortens the tact time required for heating a substrate. The substrate heating apparatus of the embodiment includes: a depressurizing section capable of decompressing a substrate coated with a solution for forming polyimide; a first heating unit capable of heating the substrate at a f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMAYA, KENICHI, MASU, YOSHIAKI, KATO, SHIGERU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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