Substrate heating apparatus and substrate heating method shortening the tact time required for heating a substrate

This invention shortens the tact time required for heating a substrate. The substrate heating apparatus of the embodiment includes: a depressurizing section capable of decompressing a substrate coated with a solution for forming polyimide; a first heating unit capable of heating the substrate at a first temperature; and a second heating unit capable of heating the substrate at a second temperature higher than the first temperature, wherein the second heating unit is provided separately from the first heating unit.