Laser marking system and laser marking method
A laser marking system and a laser marking method are provided. The laser marking system includes a laser oscillator; a beam splitter configured to split a laser beam emitted from the laser oscillator into first and second marking laser beams; first and second beam control units disposed on movement...
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| creator | KIM, TAE-JUNG SHIN, DONG-JOON HYUN, BYUNG-HUN HWANG, YOON-SUNG |
| description | A laser marking system and a laser marking method are provided. The laser marking system includes a laser oscillator; a beam splitter configured to split a laser beam emitted from the laser oscillator into first and second marking laser beams; first and second beam control units disposed on movement paths of the first and second marking laser beams and configured to control characteristics of the first and second marking laser beams due to variations in the refractive indices of the first and second beam control units according to a change in a voltage that is applied; and first and second Galvano scanners configured to control the directions of first and second marking laser beams that have passed through the first and second beam control units. |
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The laser marking system includes a laser oscillator; a beam splitter configured to split a laser beam emitted from the laser oscillator into first and second marking laser beams; first and second beam control units disposed on movement paths of the first and second marking laser beams and configured to control characteristics of the first and second marking laser beams due to variations in the refractive indices of the first and second beam control units according to a change in a voltage that is applied; and first and second Galvano scanners configured to control the directions of first and second marking laser beams that have passed through the first and second beam control units.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170701&DB=EPODOC&CC=TW&NR=201724318A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170701&DB=EPODOC&CC=TW&NR=201724318A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, TAE-JUNG</creatorcontrib><creatorcontrib>SHIN, DONG-JOON</creatorcontrib><creatorcontrib>HYUN, BYUNG-HUN</creatorcontrib><creatorcontrib>HWANG, YOON-SUNG</creatorcontrib><title>Laser marking system and laser marking method</title><description>A laser marking system and a laser marking method are provided. 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The laser marking system includes a laser oscillator; a beam splitter configured to split a laser beam emitted from the laser oscillator into first and second marking laser beams; first and second beam control units disposed on movement paths of the first and second marking laser beams and configured to control characteristics of the first and second marking laser beams due to variations in the refractive indices of the first and second beam control units according to a change in a voltage that is applied; and first and second Galvano scanners configured to control the directions of first and second marking laser beams that have passed through the first and second beam control units.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Laser marking system and laser marking method |
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