Solution film forming method and apparatus

The present invention provides a solution film-forming method and apparatus which, when forming a film having the thickness of 50 [mu]m or less by performing elongation in the transverse direction on the film, do not generate repetitive depressed portions. The solution film-forming device (10) compr...

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Bibliographische Detailangaben
Hauptverfasser:	OHNO, SEIICHI, SAKASHITA, HIROYUKI, KOUNO, SACHIKO, FUJITA, JUMPEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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