Semiconductor device processing method for material removal

A method of removing at least a portion of a layer of material from over a semiconductor substrate that can include dispensing an etching solution over the semiconductor substrate to form a pool of etching solution on the layer of material, wherein a footprint of the pool of etching solution is less...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ROGERS, WILLIAM BOYD, ALDAS, FERDINAND, OLSON, TIMOTHY L
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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