Geometry and process optimization for ultra-high rpm plating

Various embodiments herein relate to methods and apparatus for electroplating metal onto substrates. The apparatus used to practice electroplating may be designed to have a geometric configuration that makes it difficult for air to travel and become trapped under the substrate. By using such apparat...

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Bibliographische Detailangaben

Hauptverfasser:	SWEENEY, CIAN, HE, ZHI-AN, REID, JONATHAN DAVID, ZHOU, JIAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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