Electronic device and method for assembling electronic device

Electronic device and method for assembling electronic device

An electronic device includes a transparent cover, a transparent film, a display module, a bezel and a chassis. The transparent film is attached to the transparent cover. The display module is attached to the transparent film such that the transparent film is located between the transparent cover an...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHANG, CHIA-HUAN, LIAO, YU-JING, HUANG, POIN, LIU, YI-TING, LIN, I-HSUAN, CHIEN, SHIH-PO
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator CHANG, CHIA-HUAN
LIAO, YU-JING
HUANG, POIN
LIU, YI-TING
LIN, I-HSUAN
CHIEN, SHIH-PO
description An electronic device includes a transparent cover, a transparent film, a display module, a bezel and a chassis. The transparent film is attached to the transparent cover. The display module is attached to the transparent film such that the transparent film is located between the transparent cover and the display module. The transparent film extends to the bezel and is bonded with the bezel. The chassis is connected to the bezel. By extending the transparent film to the bezel and bonding the transparent film to the bezel, the transparent film can stop liquid and thus water resistant effect is achieved. A method for assembling an electronic device is also provided here.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201703607A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201703607A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201703607A3</originalsourceid><addsrcrecordid>eNrjZLB1zUlNLinKz8tMVkhJLctMTlVIzEtRyE0tychPUUjLL1JILC5OzU3KycxLV0hFV8vDwJqWmFOcyguluRkU3VxDnD10Uwvy41OLCxKTU_NSS-JDwo0MDM0NjM0MzB2NiVEDACXHMFw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic device and method for assembling electronic device</title><source>esp@cenet</source><creator>CHANG, CHIA-HUAN ; LIAO, YU-JING ; HUANG, POIN ; LIU, YI-TING ; LIN, I-HSUAN ; CHIEN, SHIH-PO</creator><creatorcontrib>CHANG, CHIA-HUAN ; LIAO, YU-JING ; HUANG, POIN ; LIU, YI-TING ; LIN, I-HSUAN ; CHIEN, SHIH-PO</creatorcontrib><description>An electronic device includes a transparent cover, a transparent film, a display module, a bezel and a chassis. The transparent film is attached to the transparent cover. The display module is attached to the transparent film such that the transparent film is located between the transparent cover and the display module. The transparent film extends to the bezel and is bonded with the bezel. The chassis is connected to the bezel. By extending the transparent film to the bezel and bonding the transparent film to the bezel, the transparent film can stop liquid and thus water resistant effect is achieved. A method for assembling an electronic device is also provided here.</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170116&amp;DB=EPODOC&amp;CC=TW&amp;NR=201703607A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170116&amp;DB=EPODOC&amp;CC=TW&amp;NR=201703607A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHANG, CHIA-HUAN</creatorcontrib><creatorcontrib>LIAO, YU-JING</creatorcontrib><creatorcontrib>HUANG, POIN</creatorcontrib><creatorcontrib>LIU, YI-TING</creatorcontrib><creatorcontrib>LIN, I-HSUAN</creatorcontrib><creatorcontrib>CHIEN, SHIH-PO</creatorcontrib><title>Electronic device and method for assembling electronic device</title><description>An electronic device includes a transparent cover, a transparent film, a display module, a bezel and a chassis. The transparent film is attached to the transparent cover. The display module is attached to the transparent film such that the transparent film is located between the transparent cover and the display module. The transparent film extends to the bezel and is bonded with the bezel. The chassis is connected to the bezel. By extending the transparent film to the bezel and bonding the transparent film to the bezel, the transparent film can stop liquid and thus water resistant effect is achieved. A method for assembling an electronic device is also provided here.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB1zUlNLinKz8tMVkhJLctMTlVIzEtRyE0tychPUUjLL1JILC5OzU3KycxLV0hFV8vDwJqWmFOcyguluRkU3VxDnD10Uwvy41OLCxKTU_NSS-JDwo0MDM0NjM0MzB2NiVEDACXHMFw</recordid><startdate>20170116</startdate><enddate>20170116</enddate><creator>CHANG, CHIA-HUAN</creator><creator>LIAO, YU-JING</creator><creator>HUANG, POIN</creator><creator>LIU, YI-TING</creator><creator>LIN, I-HSUAN</creator><creator>CHIEN, SHIH-PO</creator><scope>EVB</scope></search><sort><creationdate>20170116</creationdate><title>Electronic device and method for assembling electronic device</title><author>CHANG, CHIA-HUAN ; LIAO, YU-JING ; HUANG, POIN ; LIU, YI-TING ; LIN, I-HSUAN ; CHIEN, SHIH-PO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201703607A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHANG, CHIA-HUAN</creatorcontrib><creatorcontrib>LIAO, YU-JING</creatorcontrib><creatorcontrib>HUANG, POIN</creatorcontrib><creatorcontrib>LIU, YI-TING</creatorcontrib><creatorcontrib>LIN, I-HSUAN</creatorcontrib><creatorcontrib>CHIEN, SHIH-PO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHANG, CHIA-HUAN</au><au>LIAO, YU-JING</au><au>HUANG, POIN</au><au>LIU, YI-TING</au><au>LIN, I-HSUAN</au><au>CHIEN, SHIH-PO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic device and method for assembling electronic device</title><date>2017-01-16</date><risdate>2017</risdate><abstract>An electronic device includes a transparent cover, a transparent film, a display module, a bezel and a chassis. The transparent film is attached to the transparent cover. The display module is attached to the transparent film such that the transparent film is located between the transparent cover and the display module. The transparent film extends to the bezel and is bonded with the bezel. The chassis is connected to the bezel. By extending the transparent film to the bezel and bonding the transparent film to the bezel, the transparent film can stop liquid and thus water resistant effect is achieved. A method for assembling an electronic device is also provided here.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW201703607A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Electronic device and method for assembling electronic device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T15%3A47%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHANG,%20CHIA-HUAN&rft.date=2017-01-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW201703607A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true