Heat treatment apparatus, abnormality detection method in heat treatment and computer readable memory medium capable of accurately detecting abnormality in the heat treatment of a substrate

The invention aims to accurately detect abnormality in the heat treatment of a substrate. A heat treatment apparatus for performing heat treatment on a wafer includes: a heat plate (132) for carrying a wafer (W) and heating the same; a plurality of wafer support members (170) arranged to project hig...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SAIKUSA, TAKESHI, MORI, YASUO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SAIKUSA, TAKESHI
MORI, YASUO
description The invention aims to accurately detect abnormality in the heat treatment of a substrate. A heat treatment apparatus for performing heat treatment on a wafer includes: a heat plate (132) for carrying a wafer (W) and heating the same; a plurality of wafer support members (170) arranged to project higher upward than the carrying surface (132a) of the heat plate (132); a weight sensor (184) for detecting a load that changes along with the carrying state of the wafer (W) supported by the wafer support members (170); and a control part (300) for determining that the carrying state of the wafer supported by the wafer support members (170) is abnormal when the load detected by the weight sensor (184) is smaller than a predetermined threshold value.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201703114A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201703114A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201703114A3</originalsourceid><addsrcrecordid>eNqNjU0KwjAQhbtxIeodxr1CawXXIkoPUHBZpsnUBpofksmih_NupiKCXbmZB4_3zbfMnhUhA_t0NRkGdA49cgw7wNZYr3FQPIIkJsHKGtDEvZWgDPQz0kgQVrvI5CG1EtuB0lxbP6aQKmoQ6N6t7QCFiElEw_e5efwok4F7mlsmEkJsA0_wOlt0OATafHKVbW_X-lLtydmGgkNBhrip74e8OOVlURzP5T-bFywfYRA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Heat treatment apparatus, abnormality detection method in heat treatment and computer readable memory medium capable of accurately detecting abnormality in the heat treatment of a substrate</title><source>esp@cenet</source><creator>SAIKUSA, TAKESHI ; MORI, YASUO</creator><creatorcontrib>SAIKUSA, TAKESHI ; MORI, YASUO</creatorcontrib><description>The invention aims to accurately detect abnormality in the heat treatment of a substrate. A heat treatment apparatus for performing heat treatment on a wafer includes: a heat plate (132) for carrying a wafer (W) and heating the same; a plurality of wafer support members (170) arranged to project higher upward than the carrying surface (132a) of the heat plate (132); a weight sensor (184) for detecting a load that changes along with the carrying state of the wafer (W) supported by the wafer support members (170); and a control part (300) for determining that the carrying state of the wafer supported by the wafer support members (170) is abnormal when the load detected by the weight sensor (184) is smaller than a predetermined threshold value.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170116&amp;DB=EPODOC&amp;CC=TW&amp;NR=201703114A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170116&amp;DB=EPODOC&amp;CC=TW&amp;NR=201703114A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAIKUSA, TAKESHI</creatorcontrib><creatorcontrib>MORI, YASUO</creatorcontrib><title>Heat treatment apparatus, abnormality detection method in heat treatment and computer readable memory medium capable of accurately detecting abnormality in the heat treatment of a substrate</title><description>The invention aims to accurately detect abnormality in the heat treatment of a substrate. A heat treatment apparatus for performing heat treatment on a wafer includes: a heat plate (132) for carrying a wafer (W) and heating the same; a plurality of wafer support members (170) arranged to project higher upward than the carrying surface (132a) of the heat plate (132); a weight sensor (184) for detecting a load that changes along with the carrying state of the wafer (W) supported by the wafer support members (170); and a control part (300) for determining that the carrying state of the wafer supported by the wafer support members (170) is abnormal when the load detected by the weight sensor (184) is smaller than a predetermined threshold value.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjU0KwjAQhbtxIeodxr1CawXXIkoPUHBZpsnUBpofksmih_NupiKCXbmZB4_3zbfMnhUhA_t0NRkGdA49cgw7wNZYr3FQPIIkJsHKGtDEvZWgDPQz0kgQVrvI5CG1EtuB0lxbP6aQKmoQ6N6t7QCFiElEw_e5efwok4F7mlsmEkJsA0_wOlt0OATafHKVbW_X-lLtydmGgkNBhrip74e8OOVlURzP5T-bFywfYRA</recordid><startdate>20170116</startdate><enddate>20170116</enddate><creator>SAIKUSA, TAKESHI</creator><creator>MORI, YASUO</creator><scope>EVB</scope></search><sort><creationdate>20170116</creationdate><title>Heat treatment apparatus, abnormality detection method in heat treatment and computer readable memory medium capable of accurately detecting abnormality in the heat treatment of a substrate</title><author>SAIKUSA, TAKESHI ; MORI, YASUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201703114A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SAIKUSA, TAKESHI</creatorcontrib><creatorcontrib>MORI, YASUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAIKUSA, TAKESHI</au><au>MORI, YASUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat treatment apparatus, abnormality detection method in heat treatment and computer readable memory medium capable of accurately detecting abnormality in the heat treatment of a substrate</title><date>2017-01-16</date><risdate>2017</risdate><abstract>The invention aims to accurately detect abnormality in the heat treatment of a substrate. A heat treatment apparatus for performing heat treatment on a wafer includes: a heat plate (132) for carrying a wafer (W) and heating the same; a plurality of wafer support members (170) arranged to project higher upward than the carrying surface (132a) of the heat plate (132); a weight sensor (184) for detecting a load that changes along with the carrying state of the wafer (W) supported by the wafer support members (170); and a control part (300) for determining that the carrying state of the wafer supported by the wafer support members (170) is abnormal when the load detected by the weight sensor (184) is smaller than a predetermined threshold value.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW201703114A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Heat treatment apparatus, abnormality detection method in heat treatment and computer readable memory medium capable of accurately detecting abnormality in the heat treatment of a substrate
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T02%3A50%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SAIKUSA,%20TAKESHI&rft.date=2017-01-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW201703114A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true