Flexible laminated board and multilayer circuit board
Provided is a method for manufacturing a flexible laminated board, comprising: a step for continuously feeding an insulating film comprising a liquid crystal polymer, and a metal foil, between endless belts; and a step for thermocompression bonding of the insulating film and the metal foil between t...
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| creator | TACHIBANA, EISUKE SUZUKI, TARO TOTANI, MAKOTO ARIMA, TAKAO KONDOH, KOUJI MIYAGAWA, EIJIROU KASAHARA, JUNYA |
| description | Provided is a method for manufacturing a flexible laminated board, comprising: a step for continuously feeding an insulating film comprising a liquid crystal polymer, and a metal foil, between endless belts; and a step for thermocompression bonding of the insulating film and the metal foil between the endless belts. The thermocompression step involves heating a flexible laminated board so that the maximum temperature of the flexible laminated board is within a range from 45 DEG C lower than the melting point of the liquid crystal polymer to 5 DEG C lower than the melting point, inclusive; and slow-cooling the flexible laminated board such that the exit temperature of the flexible laminated board, which is the temperature when conveyed out from between the endless belts, is within a range from 235 DEG C lower than the melting point of the liquid crystal polymer to 100 DEG C lower than the melting point, inclusive. |
| format | Patent |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Flexible laminated board and multilayer circuit board |
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