Multi-tiered tamper-resistant assembly system and method

A multi-tiered approach to combating reverse engineering of electronics is disclosed herein. The encapsulant utilized with the optical sensor may be selected based on being substantially being opaque to X-ray inspection. In this way, visible public inspection to gain competitive intelligence may be...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GONZALES, LEONARDO C, ZHILINSKY, DMITRY, LILAND, MICHAEL A, TAGLE, JOHN, KOVACS, LASZLO, FOSTER, JOHN T
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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