Plasma processing method and plasma processing apparatus

A plasma processing method including disposing a wafer to be processed on a sample stage disposed in a processing chamber within a vacuum vessel, supplying an electric field using first high frequency power for plasma forming into the processing chamber and forming plasma, and supplying second high...

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Bibliographische Detailangaben
Hauptverfasser: TERAUCHI, HIROMITSU, IIDA, TSUTOMU, OOHIRABARU, YUUZOU
Format: Patent
Sprache:chi ; eng
Schlagworte:
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