Palladium plating solution and palladium coating obtained using same

The present invention addresses the problem of providing a palladium plating solution in which occurrence of defective parts such as pin holes on a palladium coating is reduced, and in which heat resistance performance equivalent to that obtained conventionally can be obtained even when a gold plati...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OHSUKA, RYUTA, KIYOHARA, YOSHIZO, SHIBATA, KAZUYA, NAKAGAWA, YUSUKE, OKUBO, YUYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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