Trace-etching processing method of printed-circuit board product

The present invention is a Trace-etching processing method of printed-circuit board product, which is mainly to receive the material after passing the substrate product passivated with photoresist film through steps such as developing, washing after developing, low-temperature blowing dry, trace etc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZENG, SONG-YU, LIAN, CHUN-ZHI, CHEN, JUN-HONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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