Trace-etching processing method of printed-circuit board product

Trace-etching processing method of printed-circuit board product

The present invention is a Trace-etching processing method of printed-circuit board product, which is mainly to receive the material after passing the substrate product passivated with photoresist film through steps such as developing, washing after developing, low-temperature blowing dry, trace etc...

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Hauptverfasser: ZENG, SONG-YU, LIAN, CHUN-ZHI, CHEN, JUN-HONG
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Sprache:chi ; eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator ZENG, SONG-YU
LIAN, CHUN-ZHI
CHEN, JUN-HONG
description The present invention is a Trace-etching processing method of printed-circuit board product, which is mainly to receive the material after passing the substrate product passivated with photoresist film through steps such as developing, washing after developing, low-temperature blowing dry, trace etching, water rinsing, stripping, water rinsing, and baking dry, etc. Apply a low-temperature blowing dry step to the substrate product after the step of washing after developing, and before the trace etching. Also, the temperature is controlled to be 30 DEG C~40 DEG C, so that the developed photoresist film can be cured by the low-temperature blowing dry step. Then performing the technical means of the following trace etching step, so as to effectively reduce the occurrence rate of thinning photoresist film, and reducing the occurrence rate of broken vias. As a result, the yield rate of trace-etching process of printed-circuit board product is increased.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201605308A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201605308A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201605308A3</originalsourceid><addsrcrecordid>eNrjZHAIKUpMTtVNLUnOyMxLVygoyk9OLS4GMXNTSzLyUxTy04CCmXklqSm6yZlFyaWZJQpJ-YlFKSClKaXJJTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4AGh6XmpJfEi4kYGhmYGpsYGFozExagDw_zG9</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Trace-etching processing method of printed-circuit board product</title><source>esp@cenet</source><creator>ZENG, SONG-YU ; LIAN, CHUN-ZHI ; CHEN, JUN-HONG</creator><creatorcontrib>ZENG, SONG-YU ; LIAN, CHUN-ZHI ; CHEN, JUN-HONG</creatorcontrib><description>The present invention is a Trace-etching processing method of printed-circuit board product, which is mainly to receive the material after passing the substrate product passivated with photoresist film through steps such as developing, washing after developing, low-temperature blowing dry, trace etching, water rinsing, stripping, water rinsing, and baking dry, etc. Apply a low-temperature blowing dry step to the substrate product after the step of washing after developing, and before the trace etching. Also, the temperature is controlled to be 30 DEG C~40 DEG C, so that the developed photoresist film can be cured by the low-temperature blowing dry step. Then performing the technical means of the following trace etching step, so as to effectively reduce the occurrence rate of thinning photoresist film, and reducing the occurrence rate of broken vias. As a result, the yield rate of trace-etching process of printed-circuit board product is increased.</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160201&amp;DB=EPODOC&amp;CC=TW&amp;NR=201605308A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160201&amp;DB=EPODOC&amp;CC=TW&amp;NR=201605308A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZENG, SONG-YU</creatorcontrib><creatorcontrib>LIAN, CHUN-ZHI</creatorcontrib><creatorcontrib>CHEN, JUN-HONG</creatorcontrib><title>Trace-etching processing method of printed-circuit board product</title><description>The present invention is a Trace-etching processing method of printed-circuit board product, which is mainly to receive the material after passing the substrate product passivated with photoresist film through steps such as developing, washing after developing, low-temperature blowing dry, trace etching, water rinsing, stripping, water rinsing, and baking dry, etc. Apply a low-temperature blowing dry step to the substrate product after the step of washing after developing, and before the trace etching. Also, the temperature is controlled to be 30 DEG C~40 DEG C, so that the developed photoresist film can be cured by the low-temperature blowing dry step. Then performing the technical means of the following trace etching step, so as to effectively reduce the occurrence rate of thinning photoresist film, and reducing the occurrence rate of broken vias. As a result, the yield rate of trace-etching process of printed-circuit board product is increased.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAIKUpMTtVNLUnOyMxLVygoyk9OLS4GMXNTSzLyUxTy04CCmXklqSm6yZlFyaWZJQpJ-YlFKSClKaXJJTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4AGh6XmpJfEi4kYGhmYGpsYGFozExagDw_zG9</recordid><startdate>20160201</startdate><enddate>20160201</enddate><creator>ZENG, SONG-YU</creator><creator>LIAN, CHUN-ZHI</creator><creator>CHEN, JUN-HONG</creator><scope>EVB</scope></search><sort><creationdate>20160201</creationdate><title>Trace-etching processing method of printed-circuit board product</title><author>ZENG, SONG-YU ; LIAN, CHUN-ZHI ; CHEN, JUN-HONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201605308A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2016</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZENG, SONG-YU</creatorcontrib><creatorcontrib>LIAN, CHUN-ZHI</creatorcontrib><creatorcontrib>CHEN, JUN-HONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZENG, SONG-YU</au><au>LIAN, CHUN-ZHI</au><au>CHEN, JUN-HONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Trace-etching processing method of printed-circuit board product</title><date>2016-02-01</date><risdate>2016</risdate><abstract>The present invention is a Trace-etching processing method of printed-circuit board product, which is mainly to receive the material after passing the substrate product passivated with photoresist film through steps such as developing, washing after developing, low-temperature blowing dry, trace etching, water rinsing, stripping, water rinsing, and baking dry, etc. Apply a low-temperature blowing dry step to the substrate product after the step of washing after developing, and before the trace etching. Also, the temperature is controlled to be 30 DEG C~40 DEG C, so that the developed photoresist film can be cured by the low-temperature blowing dry step. Then performing the technical means of the following trace etching step, so as to effectively reduce the occurrence rate of thinning photoresist film, and reducing the occurrence rate of broken vias. As a result, the yield rate of trace-etching process of printed-circuit board product is increased.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Trace-etching processing method of printed-circuit board product
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T22%3A22%3A02IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZENG,%20SONG-YU&rft.date=2016-02-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW201605308A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true