Cleaning apparatus

Apparatus for cleaning a workpiece to remove foreign matter sticking to the workpiece includes a chuck table having a holding surface for holding the workpiece and a cleaning unit provided so as to face the workpiece for spraying a cleaning fluid to clean the workpiece. The cleaning unit includes a cleaning nozzle having a nozzle hole for spraying the cleaning fluid toward the workpiece, and a water film forming nozzle having an annular slit formed so as to surround the nozzle hole of the cleaning nozzle. The annular slit sprays the cleaning fluid in the form of a film having a conical shape, and extends from the annular slit to the workpiece held on the chuck table. The cleaning fluid sprayed from the nozzle hole of the cleaning nozzle has a columnar shape surrounded by the cleaning fluid sprayed from the annular slit of the water film forming nozzle.