Floorplanning approach for mixed-size modules

The invention related to a fixed-outline floor-planning approach for mixed-size modules. Firstly, all mixed-size circuit modules are spread into the whole chip. Then, in the limitation of maintaining the relative position of the circuit module and meeting the fix frame, use recursive partition based approach to generate a slicing tree, and at a pre-condition to stop the partition. Finally, use the method of merging shape curves to remove the overlap of the circuits and to find the best solution, which each node form a curve is the result of the floor-planning approach. The shape curve for each leaf is built first by enumerated packing. Then, the curves are merged iteratively from bottom to top. Finally, a feasible solution in the shape curve of the toot is obtained according to the fixed outline constraint, and the shapes and locations of modules are determined by a top-down procedure.