Method of bonding flexible printed circuit board (FPCB), panel-FPCB assembly, and display device including the same
A method of bonding a flexible printed circuit board (FPCB) is provided. The method includes disposing a bonding material on a connection unit of a panel, disposing a connection unit of the FPCB on the bonding material; disposing a thermally conductive sheet on the connection unit of the FPCB; and h...
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| creator | JEE, AN-HO YOON, SEOK-HOON LEE, YOUNG-HOON HAN, JONG-HEON |
| description | A method of bonding a flexible printed circuit board (FPCB) is provided. The method includes disposing a bonding material on a connection unit of a panel, disposing a connection unit of the FPCB on the bonding material; disposing a thermally conductive sheet on the connection unit of the FPCB; and heating and pressing the connection unit of the FPCB onto the connection unit of the panel. The thermally conductive sheet includes through holes that are formed in the thermally conductive sheet or grooves that are formed in a bottom surface of the thermally conductive sheet. In the operation of heating and pressing the connection unit of the FPCB, extended portions of the FPCB are accepted into the through holes or the grooves in the thermally conductive sheet. |
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In the operation of heating and pressing the connection unit of the FPCB, extended portions of the FPCB are accepted into the through holes or the grooves in the thermally conductive sheet.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FREQUENCY-CHANGING ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; NON-LINEAR OPTICS ; OPTICAL ANALOGUE/DIGITAL CONVERTERS ; OPTICAL LOGIC ELEMENTS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141116&DB=EPODOC&CC=TW&NR=201444437A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141116&DB=EPODOC&CC=TW&NR=201444437A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JEE, AN-HO</creatorcontrib><creatorcontrib>YOON, SEOK-HOON</creatorcontrib><creatorcontrib>LEE, YOUNG-HOON</creatorcontrib><creatorcontrib>HAN, JONG-HEON</creatorcontrib><title>Method of bonding flexible printed circuit board (FPCB), panel-FPCB assembly, and display device including the same</title><description>A method of bonding a flexible printed circuit board (FPCB) is provided. The method includes disposing a bonding material on a connection unit of a panel, disposing a connection unit of the FPCB on the bonding material; disposing a thermally conductive sheet on the connection unit of the FPCB; and heating and pressing the connection unit of the FPCB onto the connection unit of the panel. The thermally conductive sheet includes through holes that are formed in the thermally conductive sheet or grooves that are formed in a bottom surface of the thermally conductive sheet. In the operation of heating and pressing the connection unit of the FPCB, extended portions of the FPCB are accepted into the through holes or the grooves in the thermally conductive sheet.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FREQUENCY-CHANGING</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>NON-LINEAR OPTICS</subject><subject>OPTICAL ANALOGUE/DIGITAL CONVERTERS</subject><subject>OPTICAL LOGIC ELEMENTS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDEKwkAQRdNYiHqHsVNIQI1grcFgI1gELMNkZ2IGNrtLdiPm9kbxAP7m8eDxp5G_cmgsga2hsobEPKDW_JJKM7hOTGACJZ3qJYwBdgSr_Jad1jE4NKyTjwB6z22lhxjQEJB4p3EA4qcoBjFK99_j0DB4bHkeTWrUnhc_zqJlfi6yS8LOluwdKjYcyuK-22z349LDMf2neQMEe0J0</recordid><startdate>20141116</startdate><enddate>20141116</enddate><creator>JEE, AN-HO</creator><creator>YOON, SEOK-HOON</creator><creator>LEE, YOUNG-HOON</creator><creator>HAN, JONG-HEON</creator><scope>EVB</scope></search><sort><creationdate>20141116</creationdate><title>Method of bonding flexible printed circuit board (FPCB), panel-FPCB assembly, and display device including the same</title><author>JEE, AN-HO ; YOON, SEOK-HOON ; LEE, YOUNG-HOON ; HAN, JONG-HEON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201444437A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FREQUENCY-CHANGING</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>NON-LINEAR OPTICS</topic><topic>OPTICAL ANALOGUE/DIGITAL CONVERTERS</topic><topic>OPTICAL LOGIC ELEMENTS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</topic><toplevel>online_resources</toplevel><creatorcontrib>JEE, AN-HO</creatorcontrib><creatorcontrib>YOON, SEOK-HOON</creatorcontrib><creatorcontrib>LEE, YOUNG-HOON</creatorcontrib><creatorcontrib>HAN, JONG-HEON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JEE, AN-HO</au><au>YOON, SEOK-HOON</au><au>LEE, YOUNG-HOON</au><au>HAN, JONG-HEON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of bonding flexible printed circuit board (FPCB), panel-FPCB assembly, and display device including the same</title><date>2014-11-16</date><risdate>2014</risdate><abstract>A method of bonding a flexible printed circuit board (FPCB) is provided. The method includes disposing a bonding material on a connection unit of a panel, disposing a connection unit of the FPCB on the bonding material; disposing a thermally conductive sheet on the connection unit of the FPCB; and heating and pressing the connection unit of the FPCB onto the connection unit of the panel. The thermally conductive sheet includes through holes that are formed in the thermally conductive sheet or grooves that are formed in a bottom surface of the thermally conductive sheet. In the operation of heating and pressing the connection unit of the FPCB, extended portions of the FPCB are accepted into the through holes or the grooves in the thermally conductive sheet.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF |
| title | Method of bonding flexible printed circuit board (FPCB), panel-FPCB assembly, and display device including the same |
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