Adjustable current shield for electroplating processes

Adjustable current shield for electroplating processes

One illustrative plating apparatus disclosed herein includes a substrate holder that is adapted to receive a substrate, an anode and an adjustable current shield positioned between the substrate holder and the anode. In this illustrative embodiment, the adjustable current shield includes a stationar...

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Hauptverfasser: SANDMANN, GUNTHER WILHELM, SCHROIFF, CHRISTIAN, SIURY, KERSTIN
Format: Patent
Sprache:chi ; eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator SANDMANN, GUNTHER WILHELM
SCHROIFF, CHRISTIAN
SIURY, KERSTIN
description One illustrative plating apparatus disclosed herein includes a substrate holder that is adapted to receive a substrate, an anode and an adjustable current shield positioned between the substrate holder and the anode. In this illustrative embodiment, the adjustable current shield includes a stationary member, a moveable member that is adapted to be moved relative to the stationary member and a plurality of current shield members that are operatively coupled to either the stationary member or the moveable member, wherein each of the current shield members is rotatably pinned to either the stationary member or the moveable member and wherein each of the current shield members is adapted to rotate when there is relative movement between the moveable member and the stationary member.
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title Adjustable current shield for electroplating processes
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