Antenna apparatus and related manufacturing method

An antenna apparatus is disclosed, having: a dielectric substrate having a plating region positioned thereon, the plating region having multiple holes, and multiple palladium particles being arranged in each of the holes; and a metal layer formed on the plating region, the metal layer having multipl...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHENG, YUING, CHUANG, LENG-HSIEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An antenna apparatus is disclosed, having: a dielectric substrate having a plating region positioned thereon, the plating region having multiple holes, and multiple palladium particles being arranged in each of the holes; and a metal layer formed on the plating region, the metal layer having multiple metal roots respectively inserted into the holes, and each of the metal root being integrated with at least part of palladium particles in a corresponding hole. The difference in aperture of at least 80% of the holes with a predetermined aperture is less than 20%, the difference in deepness of at least 80% of the holes with a predetermined deepness is less than 20, and the predetermined deepness is greater than the predetermined aperture.