Bonding of thin lamina

Bonding of thin lamina

Methods and apparatus are provided for bonding a thin lamina to a carrier. In some embodiments, a first side of the lamina is separably contacted to a support plate. A first carrier having a first side with a layer of adhesive material is contacted to the second side of the thin lamina. The lamina i...

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Hauptverfasser: ZUNIGA, STEVE, SUBBARAMAN, VENKATESWARAN, BABAYAN, STEVE, LELAND, ORION, PETERSON, STEVE, TOLLES, ROBERT, LEON GUERRERO, KEENAN K
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ZUNIGA, STEVE
SUBBARAMAN, VENKATESWARAN
BABAYAN, STEVE
LELAND, ORION
PETERSON, STEVE
TOLLES, ROBERT
LEON GUERRERO, KEENAN K
description Methods and apparatus are provided for bonding a thin lamina to a carrier. In some embodiments, a first side of the lamina is separably contacted to a support plate. A first carrier having a first side with a layer of adhesive material is contacted to the second side of the thin lamina. The lamina is fixed to the first carrier, where the fixing includes a first application of heat and pressure to a portion of the lamina and the first carrier. The support plate is removed, and a second application of heat and pressure are applied to the lamina and the first carrier. The second application of heat and pressure promotes an adhesive bond between the lamina and the first carrier. The second application of pressure comprises moving the lamina, the first carrier and a cover sheet between a pair of rollers.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Bonding of thin lamina
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