Chip assembly configuration with densely packed optical interconnects

A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversio...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG, DAWEI, MCELFRESH, DAVID K, RAJ, KANNAN, ANESHANSLEY, NICHOLAS E, SZE, THERESA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS
Online-Zugang:	Volltext bestellen
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