Three dimensional passive multi-component structures

Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ARNOLD, SHAWN X, THOMA, JEFFREY M, KENYU, TOJIMA, KIDD, DOUGLAS P, PYPER, DENNIS R, MULLINS, SCOTT P, MAYO, SEAN A
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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