A transparent atom trapping chip and its heat dissipation device

This invention relates to the fabrication process of a transparent atom trapping chip with the function of laser beam penetrating through the glass substrate and the ability of heat dissipation. The characteristic of the device is to use the transparent glass as the atom chip substrate, which allowing the penetration of the laser beam. Thus it increases the design flexibility of magneto-optical trap (MOT) in atomic physics experiments. In addition, the design of heat dissipation devices is to use couple electroplated through-via copper pillars in the glass substrate. The heat generated from the metal wires on chip surface can be conducted to the back side of the chip via those copper pillars. The maximum burned-out current of metal wires can be increased by using the glass as the chip substrate. Besides, in this invention the areas without metal wires passing through are also designed with couple heat dissipation copper blocks to increase the heat conducting area on the chip surface. The heat dissipating in b