Rate scalable connector for high bandwidth consumer applications

Methods and systems may include an input/output (IO) interface that has an integrated buffer, a housing and a substrate disposed within the housing. The substrate may include a first side, a second side and a connection edge. The integrated buffer can be coupled to at least one of the first side and...

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Bibliographische Detailangaben
Hauptverfasser: MOONEY, STEPHEN R, PEDERSON, BRUCE E, JAUSSI, JAMES E, HECK, HOWARD L
Format: Patent
Sprache:chi ; eng
Schlagworte:
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