Serial link interconnection arrangement for backplane with embedded waveguide

A serial link interconnection arrangement for interconnecting a first printed circuit board (BoardA) with a second printed circuit board (BoardB), both boards being inserted in a backplane of a telecommunication system. The arrangement comprises a waveguide embedded in the backplane. A first end (Wa...

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1. Verfasser: HOOGHE, KOEN
Format: Patent
Sprache:chi ; eng
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