High strength and high elongation ratio of Au alloy bonding wire

To acquire the best combination of elongation and breaking strength on the Au alloy bonding wire. Adding 0.5-30 wt% of at least one element among Cu, Ag, Pd and Pt to high purity Au, a flat area about elongation ratio change appears between the range of 450-650 DEG C of heat-treatment temperature at...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MIKAMI, MICHITAKA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS METALLURGY SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!