Light emiting diode package structure and manufacturing method thereof

A light emiting diode (LED) package structure and a manufacturing method thereof are provided. The LED package structure includes a carrier, a LED, a wire and a modeling material. The carrier has a concave. The LED is disposed at the bottom of the concave. The wire connects the LED and the carrier....

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Bibliographische Detailangaben

Hauptverfasser:	CHEN, YI-JYUN, TAI, WEN-WAN, LEE, YUUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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