Light emiting diode package structure and manufacturing method thereof

A light emiting diode (LED) package structure and a manufacturing method thereof are provided. The LED package structure includes a carrier, a LED, a wire and a modeling material. The carrier has a concave. The LED is disposed at the bottom of the concave. The wire connects the LED and the carrier....

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHEN, YI-JYUN, TAI, WEN-WAN, LEE, YUUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A light emiting diode (LED) package structure and a manufacturing method thereof are provided. The LED package structure includes a carrier, a LED, a wire and a modeling material. The carrier has a concave. The LED is disposed at the bottom of the concave. The wire connects the LED and the carrier. The modeling material covers the LED and the wire. The modeling material includes a first modeling portion and a second modeling portion. The first modeling portion is disposed near the bottom of the concave. The second modeling portion is disposed near the opening of the concave and the hardness thereof is larger than that of the first modeling portion.