Electronic component material

An electronic component material, including a substrate made of an Al alloy and a first plating layer formed on a surface of the substrate, the material characterized in that the Al alloy is annealed to have a tensile strength of 200-300 MPa and a Vickers hardness of 65-100, and the first plating la...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIMURA, MASAYASU, KATAYAMA, SATORU, ISEKI, SHIGERU, MATSUDA, HIDEHARU, MITSUI, TOSHIYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	An electronic component material, including a substrate made of an Al alloy and a first plating layer formed on a surface of the substrate, the material characterized in that the Al alloy is annealed to have a tensile strength of 200-300 MPa and a Vickers hardness of 65-100, and the first plating layer is made of any one or more of Ni, Ni alloy, Cu, Cu alloy, Ag, Ag alloy, Sn, Sn alloy, Pd, Pd alloy, Au, and Au alloy. The material can replace a Cu alloy, be lightweight, and reduce raw material cost.