Method for forming bump

This invention provides a method for forming a bump which can increase a height of the bump and restrain a deviation of the height of the bump. The method for forming the bump of this invention includes: printing a solder paste on the electrodes using a first mask to form a first solder paste layer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIBATA, SEIJI, KASAHARA, TOMOHIKO, NAKAJI, SHOICHI, MIURA, HIROSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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