Method for forming bump

Method for forming bump

This invention provides a method for forming a bump which can increase a height of the bump and restrain a deviation of the height of the bump. The method for forming the bump of this invention includes: printing a solder paste on the electrodes using a first mask to form a first solder paste layer...

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Hauptverfasser: SHIBATA, SEIJI, KASAHARA, TOMOHIKO, NAKAJI, SHOICHI, MIURA, HIROSHI
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SHIBATA, SEIJI
KASAHARA, TOMOHIKO
NAKAJI, SHOICHI
MIURA, HIROSHI
description This invention provides a method for forming a bump which can increase a height of the bump and restrain a deviation of the height of the bump. The method for forming the bump of this invention includes: printing a solder paste on the electrodes using a first mask to form a first solder paste layer on electrodes; removing the first mask, melting the first solder paste layer and then solidifying the same to form first bumps on the electrodes; printing a solder paste on the first bumps using a second mask showing an oil proof property to form a second solder paste layer on the first bumps; removing the second mask, melting and integrating the first bumps and the second solder paste layer and then solidifying the same to form second bumps on the electrodes.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for forming bump
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