Quad flat no-lead package and method for forming the same

A Quad Flat No-Lead Package is proposed, comprising a die-mounting base; a plurality of electrical connecting pads disposed at the periphery of the die-mounting base, wherein the bottom surfaces of the die-mounting base and the electrical connecting pads are covered by a copper layer; a die mounted...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TANG, FU-DI, LIN, YUNGIH, WEI, CHINGIUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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