Camera module and method for manufacturing and cleaning same

A method for manufacturing a camera module, wherein the camera module includes a lens, a sensor, a printed circuit board for carrying the sensor, and a holder for connecting the lens and the printed circuit board; the method includes steps of: preparing a cleaning hole on the holder and sealing the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LIAO, HSIANG-KAI, CHANG, POUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY PHOTOGRAPHY PHYSICS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for manufacturing a camera module, wherein the camera module includes a lens, a sensor, a printed circuit board for carrying the sensor, and a holder for connecting the lens and the printed circuit board; the method includes steps of: preparing a cleaning hole on the holder and sealing the cleaning hole with a removable sealing material; assembling the printed circuit board, the sensor, the holder, and the lens, finding whether particles exist within the assembled camera module or not; and once any particle is found in the camera module, removing the sealing material, cleaning the camera module through the cleaning hole, and then sealing the cleaning hole again.