Micro electro mechanical device package and method of manufacturing a micro electro mechanical device package

Micro electro mechanical device package and method of manufacturing a micro electro mechanical device package

The present invention relates to a micro electro mechanical device package, comprising: a composite structure comprising a substrate and at least one further layer provided on the substrate, wherein the composite structure comprises a cavity extending from the top surface of the composite structure...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PHYO, PHYO THAW, HO, SOON WEE, KRIPESH, VAIDYANATHAN, MYO, EI PA PA, WAI, LEONG CHING, ISHII, FUSAO, YU, AI-BIN, SOUNDARAPANDIAN, MOHANRAJ
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:The present invention relates to a micro electro mechanical device package, comprising: a composite structure comprising a substrate and at least one further layer provided on the substrate, wherein the composite structure comprises a cavity extending from the top surface of the composite structure into the substrate; a micro electro mechanical device provided within the cavity; a transparent plate covering the cavity such that the cavity is hermetically sealed; and package contact pads for electrically contacting the package, wherein the micro electro mechanical device is electrically connected to the package contact pads.