Method of forming openings in a semiconductor device and semiconductor device

A method of forming openings (26) to a layer (4, 6, 14) of a semiconductor device comprises forming a dielectric layer (20) over the layer of the semiconductor device, and forming a mask (23) over the dielectric layer. The mask comprises a plurality of mask openings (24, 25) arranged in a regular pa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AMINPUR, MASSUD ABUBAKER, CONLEY, WILL, WARRICK, SCOTT, RIVIERE-CAZEAUX, LIONEL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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