Package of chip-scale type image sensor chip
A package of chip-scale type image sensor chip is disclosed, which has an image sensor chip, a flexible film wrapping the chip, and a hard light-transmissive plate. The chip has an action surface. The action surface has a sensing area located at the center, and some conductive contacts formed around...
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| creator | BAI, JIN-QUAN HUANG, ZHI-GONG |
| description | A package of chip-scale type image sensor chip is disclosed, which has an image sensor chip, a flexible film wrapping the chip, and a hard light-transmissive plate. The chip has an action surface. The action surface has a sensing area located at the center, and some conductive contacts formed around the sensing area. The flexible film has a window, and plural conductive leads disposed on the film surface and located around the window. The film wraps the chip in the way that the window corresponds to the chip-sensing area. In addition, one end of each conductive lead of the film forms electrical connection with each electrical contact of the chip. The other end of each conductive lead of the film is exposed outside for electrically connecting with the other external elements. The hard light-transmissive plate is disposed above the window in the way of forming a sealed region around the chip-sensing area. |
| format | Patent |
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The action surface has a sensing area located at the center, and some conductive contacts formed around the sensing area. The flexible film has a window, and plural conductive leads disposed on the film surface and located around the window. The film wraps the chip in the way that the window corresponds to the chip-sensing area. In addition, one end of each conductive lead of the film forms electrical connection with each electrical contact of the chip. The other end of each conductive lead of the film is exposed outside for electrically connecting with the other external elements. The hard light-transmissive plate is disposed above the window in the way of forming a sealed region around the chip-sensing area.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090401&DB=EPODOC&CC=TW&NR=200915547A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090401&DB=EPODOC&CC=TW&NR=200915547A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BAI, JIN-QUAN</creatorcontrib><creatorcontrib>HUANG, ZHI-GONG</creatorcontrib><title>Package of chip-scale type image sensor chip</title><description>A package of chip-scale type image sensor chip is disclosed, which has an image sensor chip, a flexible film wrapping the chip, and a hard light-transmissive plate. 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The hard light-transmissive plate is disposed above the window in the way of forming a sealed region around the chip-sensing area.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJSEzOTkxPVchPU0jOyCzQLU5OzElVKKksSFXIzAVJFKfmFecXgSV5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakl8SLiRgYGloampibmjMTFqAFTPKWY</recordid><startdate>20090401</startdate><enddate>20090401</enddate><creator>BAI, JIN-QUAN</creator><creator>HUANG, ZHI-GONG</creator><scope>EVB</scope></search><sort><creationdate>20090401</creationdate><title>Package of chip-scale type image sensor chip</title><author>BAI, JIN-QUAN ; HUANG, ZHI-GONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW200915547A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BAI, JIN-QUAN</creatorcontrib><creatorcontrib>HUANG, ZHI-GONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BAI, JIN-QUAN</au><au>HUANG, ZHI-GONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Package of chip-scale type image sensor chip</title><date>2009-04-01</date><risdate>2009</risdate><abstract>A package of chip-scale type image sensor chip is disclosed, which has an image sensor chip, a flexible film wrapping the chip, and a hard light-transmissive plate. The chip has an action surface. The action surface has a sensing area located at the center, and some conductive contacts formed around the sensing area. The flexible film has a window, and plural conductive leads disposed on the film surface and located around the window. The film wraps the chip in the way that the window corresponds to the chip-sensing area. In addition, one end of each conductive lead of the film forms electrical connection with each electrical contact of the chip. The other end of each conductive lead of the film is exposed outside for electrically connecting with the other external elements. The hard light-transmissive plate is disposed above the window in the way of forming a sealed region around the chip-sensing area.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Package of chip-scale type image sensor chip |
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