Heat treatment apparatus with thermal uniformity

Disclosed herein is a heat treatment apparatus with thermal uniformity, wherein a semiconductor wafer is rotated by a heating device to make a heating process uniform with the flow of hot gas; a flow control device is disposed at an outlet pipe to adjust the size of the outlet pipe and control the g...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YIN, AN-HO, HSIEH, HAM-MING, LIU, DER-YUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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