Electronic component built-in substrate and method for manufacturing the same

It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least the board 10. Also, the boards 10 and 20 are electri...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	INOUE, AKINOBU, YOSHINO, YUYA, TSUBOTA, TAKASHI, KAJIKI, ATSUNORI, NORIO YAMANISHI, AKAIKE, SADAKAZU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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