Electronic component built-in substrate and method for manufacturing the same

It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least the board 10. Also, the boards 10 and 20 are electri...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	INOUE, AKINOBU, YOSHINO, YUYA, TSUBOTA, TAKASHI, KAJIKI, ATSUNORI, NORIO YAMANISHI, AKAIKE, SADAKAZU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	INOUE, AKINOBU YOSHINO, YUYA TSUBOTA, TAKASHI KAJIKI, ATSUNORI NORIO YAMANISHI AKAIKE, SADAKAZU
description	It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least the board 10. Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30, which faces the other board 20.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW200828567A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW200828567A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW200828567A3</originalsourceid><addsrcrecordid>eNqNyrEKwjAQANAsDqL-w_kBhVJRu4pUXNwKjuWaXmwguQvJ5f9d_ACnt7yteQ2BrGZhb8FKTMLECnP1QRvPUOpcNKMSIC8QSVdZwEmGiFwdWq3Z8wd0JSgYaW82DkOhw8-dOT6G8f5sKMlEJaElJp3Gd9e2fdefL9fb6Z_zBRXmNsY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic component built-in substrate and method for manufacturing the same</title><source>esp@cenet</source><creator>INOUE, AKINOBU ; YOSHINO, YUYA ; TSUBOTA, TAKASHI ; KAJIKI, ATSUNORI ; NORIO YAMANISHI ; AKAIKE, SADAKAZU</creator><creatorcontrib>INOUE, AKINOBU ; YOSHINO, YUYA ; TSUBOTA, TAKASHI ; KAJIKI, ATSUNORI ; NORIO YAMANISHI ; AKAIKE, SADAKAZU</creatorcontrib><description>It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least the board 10. Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30, which faces the other board 20.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080701&DB=EPODOC&CC=TW&NR=200828567A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080701&DB=EPODOC&CC=TW&NR=200828567A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>INOUE, AKINOBU</creatorcontrib><creatorcontrib>YOSHINO, YUYA</creatorcontrib><creatorcontrib>TSUBOTA, TAKASHI</creatorcontrib><creatorcontrib>KAJIKI, ATSUNORI</creatorcontrib><creatorcontrib>NORIO YAMANISHI</creatorcontrib><creatorcontrib>AKAIKE, SADAKAZU</creatorcontrib><title>Electronic component built-in substrate and method for manufacturing the same</title><description>It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least the board 10. Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30, which faces the other board 20.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDqL-w_kBhVJRu4pUXNwKjuWaXmwguQvJ5f9d_ACnt7yteQ2BrGZhb8FKTMLECnP1QRvPUOpcNKMSIC8QSVdZwEmGiFwdWq3Z8wd0JSgYaW82DkOhw8-dOT6G8f5sKMlEJaElJp3Gd9e2fdefL9fb6Z_zBRXmNsY</recordid><startdate>20080701</startdate><enddate>20080701</enddate><creator>INOUE, AKINOBU</creator><creator>YOSHINO, YUYA</creator><creator>TSUBOTA, TAKASHI</creator><creator>KAJIKI, ATSUNORI</creator><creator>NORIO YAMANISHI</creator><creator>AKAIKE, SADAKAZU</creator><scope>EVB</scope></search><sort><creationdate>20080701</creationdate><title>Electronic component built-in substrate and method for manufacturing the same</title><author>INOUE, AKINOBU ; YOSHINO, YUYA ; TSUBOTA, TAKASHI ; KAJIKI, ATSUNORI ; NORIO YAMANISHI ; AKAIKE, SADAKAZU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW200828567A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2008</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>INOUE, AKINOBU</creatorcontrib><creatorcontrib>YOSHINO, YUYA</creatorcontrib><creatorcontrib>TSUBOTA, TAKASHI</creatorcontrib><creatorcontrib>KAJIKI, ATSUNORI</creatorcontrib><creatorcontrib>NORIO YAMANISHI</creatorcontrib><creatorcontrib>AKAIKE, SADAKAZU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>INOUE, AKINOBU</au><au>YOSHINO, YUYA</au><au>TSUBOTA, TAKASHI</au><au>KAJIKI, ATSUNORI</au><au>NORIO YAMANISHI</au><au>AKAIKE, SADAKAZU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic component built-in substrate and method for manufacturing the same</title><date>2008-07-01</date><risdate>2008</risdate><abstract>It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least the board 10. Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30, which faces the other board 20.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	chi ; eng
recordid	cdi_epo_espacenet_TW200828567A
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	Electronic component built-in substrate and method for manufacturing the same
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T04%3A28%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=INOUE,%20AKINOBU&rft.date=2008-07-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW200828567A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true