Method of making a circuitized substrate having a plurality of solder connection sites thereon

A method of making a circuitized substrate in which solder material (e.g., in paste form) is deposited through a screen onto individual conductors in a spaced pattern of individual solder "islands". A solder flux is then deposited onto the "islands" causing these to spread out an...

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Hauptverfasser:	ANDERSON, STEVEN W, PALOMAKI, CHERYL L, MOORE, SCOTT P, TRAN, SON K
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	ANDERSON, STEVEN W PALOMAKI, CHERYL L MOORE, SCOTT P TRAN, SON K
description	A method of making a circuitized substrate in which solder material (e.g., in paste form) is deposited through a screen onto individual conductors in a spaced pattern of individual solder "islands". A solder flux is then deposited onto the "islands" causing these to spread out and form a continuous solder layer across the conductor's upper surface. The solder layer is then capable of coupling to an external conductor such as a solder ball, to form an electrical assembly such as might be used within an information handling system such as a personal computer.
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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	Method of making a circuitized substrate having a plurality of solder connection sites thereon
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